Semiconductor Epoxy Molding Compound


Hysol Brand Molding Compounds deliver the outstanding performance and ease of use that is expected from a world leader in materials technology. By combining low stress and low moisture absorption with high physical strength, all of Hysol’s Molding Compounds ensure an optimized process at high yields.

Hysol Epoxy Molding Compounds are designed for both Automolds and conventional molds. They are able to protect such passive components as ceramic and Tantalum (Ta) capacitors and resistors.