Hysol® Mold Compound

A BRIEF HISTORY OF HYSOL® AND GMV

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Hysol History

 

 

hysol-logo                   EMC

SEMICONDUCTOR MOLDING COMPOUNDS

Hysol Semiconductor Molding Compounds deliver the outstanding performance and ease of use that is expected from a world leader in materials technology. By combining low stress and low moisture absorption with high physical strength, all of Hysol’s molding Compounds ensure an optimized process at high yields.

ELECTRONIC MOLDING COMPOUNDS

Hysol Electronics Molding Compounds are designed for both Automolds and conventional molds. They are able to protect such passive components as ceramic and Tantalum (Ta) capacitors and resistors.

 

MOLDING COMPOUNDS FOR DIFFERENT PACKAGES

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  •  SOP QFP For SOP/ QFP: HYSOL® GR825/ HYSOL® GR828FC1 – Narrow body SOP. Low gate leakage.

 

  •   SOT SOD SMXFor SOT/ SOD/ SMX : HYSOL® GR 640HV-L1 >1000 Shots; HYSOL® GR 646 fast cure, BIM process.

 

  •  TO Exposed For TO Exposed: HYSOL® MG20KF GR260SL(IMP) (Medium Power).

 

  •  TO Fullpack For TO Fullpack: HYSOL® KL 500HT-HR/HL ; HYSOL® KL G500HT-STS; HYSOL® GR 50HT (>1.7 W/mK).

 

  •  High Voltage TO SiC Mosfet, IGBT module For High Voltage TO: HYSOL® MG 15F-0140(R); HYSOL® MG 15F-MOD2 (<1200V, RF)
  •                        For SiC Mosfet, IGBT Module: HYSOL® MG 15F-MOD2 C (<1200V, CTI 600V, Tg 235ºC)

 

  • Power Module1Power Module2For Power Module: HYSOL® GR 640A-ST4 (1/4“ V-0, UL)

 

  • CapacitorFor Capacitor: HYSOL® GR 2811 Gold, Thin Wall