A BRIEF HISTORY OF HYSOL® AND GMV

SEMICONDUCTOR MOLDING COMPOUNDS

Hysol Semiconductor Molding Compounds deliver the outstanding performance and ease of use that is expected from a world leader in materials technology. By combining low stress and low moisture absorption with high physical strength, all of Hysol’s molding Compounds ensure an optimized process at high yields.

ELECTRONIC MOLDING COMPOUNDS

Hysol Electronics Molding Compounds are designed for both Automolds and conventional molds. They are able to protect such passive components as ceramic and Tantalum (Ta) capacitors and resistors.

MOLDING COMPOUNDS FOR DIFFERENT PACKAGES

•   For SOP/ QFP: HYSOL® GR825/ HYSOL® GR828FC1 – Narrow body SOP. Low gate leakage.

•   For SOT/ SOD/ SMX : HYSOL® GR 640HV-L1 >1000 Shots; HYSOL® GR 646 fast cure, BIM process.

•   For TO Exposed: HYSOL® MG20KF GR260SL(IMP) (Medium Power).

•   For TO Fullpack: HYSOL® KL 500HT-HR/HL ; HYSOL® KL G500HT-STS; HYSOL® GR 50HT (>1.7 W/mK).

•   For High Voltage TO: HYSOL® MG 15F-0140(R); HYSOL® MG 15F-MOD2 (<1200V, RF)
•                        For SiC Mosfet, IGBT Module: HYSOL® MG 15F-MOD2 C (<1200V, CTI 600V, Tg 235ºC)

• For Power Module: HYSOL® GR 640A-ST4 (1/4“ V-0, UL)

• For Capacitor: HYSOL® GR 2811 Gold, Thin Wall